Thinfilm Receives $1.2 Million for Developing Wireless PE Sensor Labels

Innovation Norway’s Industrial Research and Development Program (“IFU”) has awarded Thinfilm a grant of NOK 7 million (approximately US$1.2 million) for commercializing Sensor Labels. The project is in collaboration with The Bemis Company, a major supplier of flexible packaging materials used by leading food, consumer products, and healthcare companies worldwide. Thinfilm together with Bemis is developing an intelligent packaging platform based on Thinfilm’s temperature sensing label. Sensor Labels monitor and record key physical properties and environmental data.

The addition of RF communication to Thinfilm’s platform will allow wireless communication of sensor information to other devices such as NFC-enabled smartphones. Thinfilm partner Inktec, in South Korea, is contributing its printing expertise to the program. Commercial products based on Thinfilm’s sensor platform are expected in 2014 and 2015.